Best Intel Xeon Heatsink

Troglodyte

Intel LGA 1200 socket: Ready for 11th Gen Intel Core processors.
Enhanced power solution: 8+1 power stages, 6-layer PCB, ProCool socket, and durable capacitors for stable power delivery.
Comprehensive cooling: VRM heatsink, flexible M.2 heatsink, PCH heatsink, hybrid fan headers and Fan Xpert 2+.
Next-gen connectivity: PCIe 4.0, Realtek 2.5Gb Ethernet, Intel Wi-Fi 6, rear USB 3.2 Gen 2, front USB 3.2 Gen 1 Type-C and Thunderbolt 4 support.
Two-way AI Noise-Cancelation: Reduce background noise from the microphone and audio output for crystal-clear communication in games or video conferences.

Chipset: Intel 5000X | Expansion Capability:3 PCI-Express Slot wired as X4 1 PCI-Express X16 Graphics slot 2 PCI-X slots 1 PCI 32 Bit | Motherboard Part Number: MY171, F9394, DT029, HR002.
Supported Processor:Two Dual-Core Intel Xeon 5100 Series 64-Bit processors with up to 1333MHz FSB and 4MB L2 Cache/Core with XD and VT capableand EIST All Intel Xeon processors support 64-Bit computing with Intel EM64T.
Supported Memory: Quad-Channel DDR2 fully Buffered DIMM (8 DIMMs Slots) Up to 64 GB DUAL Channel.
Audio:5.1 Audio Surround Sound Controller-Line-In / Line-Out/ Microphone | Video:Support for PCI Express x16 graphics cards up to 150 watts and with up to 512MB graphics memory.
Peripheral Interfaces: 6 x 2.0 USB 2 x PS/2 ports (mouse and Keyboard) 1 x parallel printer port 2 x serial ports 1 x 10/100/1000 Gigabit Port 1 x firewire (1394a) ports 2 - Audio Connections.

Compatible with Intel 500 series & select Intel 400 series chipset based motherboards.
Intel Turbo Boost Max Technology 3.0 Support.
Intel LGA 1200 Socket: Designed to unleash the maximum performance of 11th Gen Intel Core processors.
Comprehensive Cooling: Enhanced VRM heatsink, flexible M.2 heatsink, PCH heatsink, hybrid fan headers and Fan Xpert 2+.
Enhanced power solution: 8 power stages, alloy chokes and durable capacitors for stable power delivery.

Xeon. Processor family: Intel Xeon E5 V3.
Processor socket: LGA 2011-v3. Internal memory maximum support from the board: 768 GB.
Memory types supported from the board: ddr4-sdram.Supported by the processor memory clock speeds: 1600,1866,2133 MHz. Processor socket: 0.65 – 1.3 Processor Socket (Processor case): 3.0.Memory types supported: AVX 2.0.Packing size: CPU Processor: 52.5. Intel Turbo Boost Technology: 2.0.

Intel LGA 1700 socket: Ready for 12th Gen Intel Core processors, support PCIe 5.0,DDR5 and out of box Windows 11 ready.
AI Motherboard : AI Overclocking, AI cooling, AI networking(GameFirst VI) and AI noise cancellation.
Robust Power Solution: 14+1 power stages with ProCool II power connector, high-quality alloy chokes and durable capacitors to support multi-core processors.
Optimized Thermal Design: VRM heatsink, PCH fanless heatsink, double-sided M.2 heatsink, hybrid fan headers and Fan Xpert 4 utility.
High-performance Gaming Networking: On-board WiFi 6E and Intel 2.5 Gb Ethernet with ASUS LANGuard.

CPU Socket: Skylake LGA 1151, Haswell LGA1150 and LGA1155/1156 up to TDP 95 Watts.
CPU Support: LGA 1155: Intel 2nd Generation Core i7-2600, i5-2500 series & Sandy Bridge Xeon Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280.
CPU Support: LGA 1156: Intel Core i3 i3-530 & i3-540, Core i5 i5-650, i5-650, i5-660, i5-661 i5-670 & I5-750.
Material: Copper Base with Aluminum Stacked Fin with Heat Pipes.

Compatible with Intel 500 series & select Intel 400 series chipset based motherboards.
Intel LGA 1200 Socket: Designed to unleash the maximum performance of 11th Gen Intel Core processors.
Enhanced Power Solution: 14+2 DrMOS power stages, ProCool sockets, military-grade TUF components, and Digi+ VRM for maximum durability and performance.
Comprehensive Cooling : VRM heatsink, PCH fanless heatsink, M.2 heatsink, hybrid fan headers and Fan Xpert 4 utility.

2nd generation Intel Xeon Scalable processors (cascade lake-spa), Intel Xeon Scalable processors. Dual socket P (LGA 3647) Supported, CPU TDP support up to 205W TDP, 2 UPI up to 10. 4 get/s.
Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz Or 2TB DCPMM, DDR4-2666MHz, in 16 DIMM slots.
4 PCI-E 3. 0 x16, 2 PCI-E 3. 0 x8 M. 2 Interface: PCI-E 3. 0 x4 M. 2 Form Factor: 2260, 2280, 22110 M. 2 Key: M-Key, 2 PCI-E 3. 0 NV Me x4 Internal Port(s).
Intel C621 controller for 14 SATA3 (6 Gaps) ports.

Intel Xeon E5-2680 v2 Ten-Core Processor 2.8GHz 8.0GT/s 25MB LGA 2011 CPU, Retail.