Zalman STC8 Thermal Paste, 1.5g Premium CPU Thermal Compound for All Processors, Heatsink, IC, Computer Processor, Cooler, GPU, Superconducting High Viscosity, 8.3 W/m-k, 350-480 Pa.s (ZM-STC8)
- EXCELLENT STABILITY: STC 8 thermal conductivity allows heat from CPU or any computer chips to cool down and very safe as there is no electrical conductivity: 8.3 W/m-k..
- MEASURING GRADUATION: Scale marking on the syringe allows accurate and visual measurement of the content while using or reusing the product..
- OPTIMAL VISCOSITY: Particle size technology provides optimal filler density to conveniently use on any type of computer chips. 350-480 Pa.s..
- EASY TO USE AND STORE: Syringe style is easy to use and rubber-cap prevents liquid content from being hardened over a period of time if reusing is needed.
- OUTSTANDING DURABILITY: Fine micro particles fill up space between the heatsink and CPU to maximize cooling performance & RoHS Certified.